HAD2610（平面式高速固晶机）
（周期：130ms）
适用于普通贴片，二极管，三极管等
一、机型特性
1.采用国际领先的固晶，点胶，晶片搜寻系统；
2.单邦双臂结构，采用电机旋转+音圈上下驱动固晶摆臂；
3.采用丝杆伺服驱动搜寻晶片平台（X/Y）与线性电机驱动送料平台（B/C）；
4.采用晶框自动校正晶片结构以及自动扩蓝膜结构，兼容6寸和8寸晶圆；
5.采用新式恒温点胶系统；
6.采用真空漏晶检测；
7.两种上料方式：叠料方式吸支架上料或料盒方式推支架进料，人性化操作，提高生产效率；
8、收料采用：料盒方式收料，有效提高了生产效率；
9、工控机控制设备运行，简化了自动化设备的操作；
10、精准的自动化设备为企业提高生产效率，降低成本提供了有效保障，从而切实有效地提高了企业竞争力；
11、固晶位置精准及优良的一致性为后道工序提供了先天的保障。
HAD2610（Planar High-speed Die Bonder）
（Cycle: 130ms）
Suitable for ordinary chip, diode,
triode
Model Features
1. Adopt the international leading die-bonding, dispensing and wafer search system;
2. Single-bonder and double-arm structure, motor rotation + voice coil up and down to drive the solid-crystal swinging arm;
3. Using screw servo drive to search chip platform (X/Y) and linear motor drive feeding platform (B/C);
4. Adopt the crystal frame to automatically correct the wafer structure and automatically expand the blue film structure, compatible with 6-inch and 8-inch wafers;
5. Adopt the new constant temperature dispensing system;
6. Vacuum die missing test is adopted;
7. Two loading modes: stacking mode, suction bracket loading mode or material box mode, pushing bracket loading mode, humanized operation, improving production efficiency;
8. Material receiving: material box, effectively improving production efficiency;
9. IPC controls the operation of equipment, which simplifies the operation of automatic equipment;
10. Accurate automation equipment provides an effective guarantee for enterprises to improve production efficiency and reduce costs, thus effectively improving the competitiveness of enterprises;
11. Precise location and excellent consistency of die bonding provide innate guarantee for the later process.
二、规格参数/Specifications and Parameters
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1.系统功能/System Function |
4、吸晶摆臂机械手系统/Die Bonder’s Swing Arm-and-hand System |
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生产周期 /Production Cycle |
130ms（取决于晶片尺寸及支架密集度） (Depending on Die Size and Holder Density) |
吸晶摆臂 /Swing Arm of Die Bonder |
180°可旋转固晶 (Rotatable Die Bond) |
|
XY精度/Accuracy |
±1mil(±0.025mm） |
吸晶压力 /Die Bond Pressure |
可调20g—250g (Adjustable) |
|
芯片旋转/Die Rotation |
±3° |
5.送料工作平台/Loading Workbench |
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2.芯片XY工作台/Die XY Workbench |
行程范围 /Range of Stroke |
250mm*75mm |
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芯片尺寸 /Die Dimensions |
5mil×5mil-80mil×80mil |
XY分辨率 /XY Resolution |
0.02mil（0.5μm） |
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6.适用支架尺寸/Suitable Holder’s Size |
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晶片最大角度修正 /Max.Angle Correction |
±15° |
支架长度/Length |
150 ~ 250mm |
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最大芯片环尺寸 Max.Die Ring Size |
10″（254mm）外径 铁环 External Diameter Iron Ring |
支架宽度/Width |
28mm~ 75mm |
|
最大芯片面积尺寸 /Max.Die Area |
8″（210mm）扩张后 |
7.所需设施/Facilities Needed |
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分辨率 /Resolution Ratio |
1μm |
电压/频率 /Voltage/Frequency |
220V AC±5%/50HZ |
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重复率 /Repetitive Rate |
0.8μm |
压缩空气 /Compressed Air |
0.5MPa（MIN） |
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顶针Z高度行程 /Thimble Z Height Stroke |
80mil（2mm） |
额定功率 /Rated Power |
950W |
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3.图像识别系统/Image Recognition System |
耗气量 /Gas Consumption |
40L/min |
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图像识别 /Image Recognition |
256级灰度(Level Grey) |
8.体积及重量/Volume and Weight |
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分辨率 /Resolution |
656X492像素(Pixels) |
长x宽x高 /Length*Width*Height |
135X120X175cm |
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图像识别精准度 /Image Recognition Accuracy |
±0.025mil@50mil观测范围 (Scope of Observation) |
重量 /Weight |
1250kg |
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